International journal of Nano Scientific Networks and Nanotechnology (IJNN) is a multidisciplinary, peer reviewed journal which includes all the major fields in nanotechnology and Nano science. Nanoscience and nanotechnology brought up an unprecedented excitement in the scientific and engineering communities, especially the last decade. It is the engineering of functional systems at the molecular scale. This covers both current work and concepts that are more advanced.  International journal of Nano Scientific Networks and Nanotechnology   publishes original research papers during a broad area of nanoscience & engineering. IJNN provides an ideal forum for presenting original reports of theoretical and experimental nanoscience and nanotechnology research. Nanotechnology is a gathering of rising innovations in which the structure of matter is controlled at the nanometer scale, the size of little quantities of molecules, to create novel materials and gadgets that have valuable and one of kind properties. IJNN is naturally multidisciplinary, and welcomes submissions across biological, physical, engineering, and computer sciences. Contributions from both academia and industry are equally encouraged. IJNN also publishes innovative techniques and instrumentation for the fabrication, characterization and testing of nano-enabled devices and technologies, as well as advanced modelling and simulation methods.


committee

Members

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Cemal Basaran

Professor

Ph.D. Engineering Mechanics, University of Arizona, Tucson, AZ December 22, 1994. Cum. G.P.A. 4.00/4.00
M.S. Civil Engineering, M.I.T., Cambridge, MA,
May 27, 1988. Cum. G.P.A. 4.80/5.00
BSc. Civil Engineering, Yildiz Technical University, Istanbul.
Class of ’82 University-Wide Valedictorian.

Young Investigator Award, Department of Defense ONR, 1997, ($500,000.0). In 1997 one of the 29 junior faculty members and the only Civil Engineering faculty in the U.S. to receive the award.)
Riefler Award, State University of New York at Buffalo, 1997.
Cemal Basaran
01/23/18
2
Associate Editor of the Year Award, ASME Journal of Electronic Packaging, , 2005.
Fellow of ASME, May 1, 2008
EEPD Excellence in Mechanics Award, ASME, 2011.
Outstanding Paper Award, Itherm 2012 Mechanics Track, 13th Intersociety Conference on Thermal and Thermomechanical Phenomenon in Electronic Systems, San Diego, CA May30-June 1, 2012

Associate Editor, IEEE Components, Packaging and Manufacturing Tech., January 2011- present
Associate Editor, ASCE Journal of Nanomechanics and Micromechanics, March 2011 - present
Associate Editor, ASME Journal of Electronic Packaging, October 2003- June 2012.
Associate Editor, IEEE Trans. On Advanced Packaging, July 2003 –December 2010
Editorial Board, International Journal of Technology and Management, March 2012- March 2013
Regional Editor for Americas, Int. Journal of Materials and Structural Integrity, 2006-present
Editorial Advisory Board, The Open Civil Engineering Journal, 2007 – present.
Editorial Board, J. of Recent Patents On Electrical Engineering, January 2008 – March 2012
Editorial Advisory Board, The Open Numerical Methods Journal, September 2, 2008 –July 2014.
Editorial Board, ISRN Mechanical Engineering, October 2010 – 2014
Editorial Board, International Scholarly Research Notices, Mechanical Engineering October 2014 – November 2016.
Editorial Board, ISRN Electronics, November 2011- June 2014.
Editor, MOJ, Civil Engineering, July 2016-present
Editorial Board, Advanced Nano-Bio-Materials and Devices, February 2017 – present
Editorial Board, International Journal of Advanced Applied Physics Research April 2017- present
Editorial Board, Journal of Advanced Engineering, May 2017 – present.
Editorial Board, Research & Development in Materials Science, October 2017 – present. Guest Editor, International Journal of Damage Mechanics. (Special issues on Electronic Packaging April 2001, July 2001
Guest Co-Editor, International Journal of Materials and Production Technology, special issue on Micro/Nano Electronics, NEMS and MEMS Packaging, vol. 34 No1/2, 2009
Guest-Editor, ASME Journal of Electronic Packaging, Special Issue on Carbon Nano Tube and Graphene in Electronics, and NEMS, June 2011
Cemal Basaran
01/23/18
3
Guest Editor, ASCE Journal of Nanomechanics and Micromechanics Inaugural issue on recent Advances in Nanomechanics and Micromechanics, March 2011

Desai, C.S., Basaran, C., and Wu, Z. "Numerical Algorithms and Mesh Dependence in the Disturbed State Concept," Int. Journal for Numerical Methods in Engineering, Vol. 40, 3059-3083, 1997.

Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept Part I: Theory and Formulation " Trans. of ASME, Journal of Electronic Packaging, Vol. 120, No. 1, pp. 41- 47, 1998.

Basaran, C., Desai, C.S., and Kundu, T. "Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept Constitutive

Models: Part II: Verification and Application ", Trans. of ASME, Journal of Electronic Packaging, Vol. 120, No. 1, pp. 48-53, 1998.

Desai, C. S., Basaran, C., Dishongh, T. and Prince, J.,"Thermomechanical Analysis in Electronic Packaging with Unified Constitutive Models for Materials and Joints,” IEEE Trans. on Comp. Pack. And Manu. Tech, Part B, Trans. on Advanced Packaging, Vol. 21, No. 1, 87-97, 1998.

Basaran, C., and Chandaroy, R.,"Finite Element Simulation of the Temperature Cycling Tests," IEEE, Transactions on Components Packaging and Manufacturing Technology - Part A, Vol. 20, No. 4, pp. 530-536, 1997.#3

Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part I: Theory", Trans. of ASME, Journal of Electronic Packaging, Vol. 121, Number 1, pp. 8-12, March 1999. #7a

Basaran, C., and Chandaroy, R.,"Nonlinear Dynamic Analysis of Surface Mount Interconnects, Part II: Applications", Trans. of ASME, Journal of Electronic Packaging, Vol. 121, No 1, pp. 12-17, March 1999. #7b

Basaran, C., and Chandaroy, R., "Mechanics of Pb40/Sn60 Near –Eutectic Solder Alloys Subjected to Vibrations," Journal of Applied Mathematical Modeling, Vol. 22, pp. 601- 627, 1998, #8.

Basaran, C., and Yan. C.Y."A Thermodynamic Framework for Damage Mechanics of Solder Joints,” Trans. of ASME, Journal of Electronic Packaging, Vol. 120, 379-384, 1998. #12

Chandaroy, R. and Basaran, C.,"Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loadings," Trans. of ASME, Journal of Electronic Packaging, Vol. 121, pp. 61-68, 1999.

Basaran, C.,”Using Finite Element Analysis for Simulation of Reliability Tests on Solder Joints in Microelectronics Packaging,” Computers & Structures, Vol. 74, Issue 2, pp.

215-231, November, 1999. #9

Basaran, C. and Zhao, Y.,”Closed Form vs. Finite Element Analysis of Laminated Stacks,” Int. J. of Finite Elements in Analysis and Design, 32, pp.163-179, 1999. #5

Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T.,”Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation,” Journal of the Mechanical Behavior of Materials, Vol. 10, No. 3, pp. 135-146, 1999. #13

Zhao, Y., Basaran, C. Cartwright, A. and Dishongh, T.,”Thermomechanical Behavior of Micron Scale Solder Joints Under Dynamic Loads,” Mechanics of Materials, Vol. 32, Issue 3, pp. 161-173, 2000. #14

Basaran, C., Zhao, Y., Cartwright, A. and Dishongh, T.,”Effects of Thermodynamic Loading,” Advanced Packaging, Vol. 1, pp. 51-58, October 2000. Review article.#17

Basaran, C.,” Disturbed State Concept for Metals and Alloys,” J. of Mechanical Behavior of Materials Vol. 10, No. 5-6, pp. 279-311, 2000.

Basaran, C. and Zhao, Y.,”Mesh Sensitivity and FEA for Multilayered Electronic Packaging,” Trans. of ASME, Journal of Electronic Packaging, Vol. 123, 3, pp. 218-224, September 2001. #22

Basaran, C., Cartwright, A. and Zhao, Y.,”Experimental Damage Mechanics of Microelectronics Solder Joints Under Concurrent Vibration and Thermal Loading,” Int. J. of Damage Mechanics, Vol. 10, No. 2 pp. 153-170, April 2001. #15

Basaran, C., Tang, H., Dishongh, T. and Searls, D.,”Computer Simulations of Solder Joint Reliability Tests,” Advanced Packaging, Vol. 1, pp. 17-22, May 2001.Review article. #27

Basaran, C., Dishongh, T., and Zhao, Y.,” Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronics Solder Joints,” Journal of Thermal Stresses, Vol. 24, No. 11, pp. 1063-1084, November, 2001. #20

Basaran, C. and Chandaroy, R.,”Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading,” Tran. ASME Journal of Electronic Packaging, Vol. 124, No 1, pp. 60-67, March 2002. #24

Basaran, C., Ye, H., Johnson, R. and Long, J., ”Moire Interferometry for Inspecting BGA Solder Balls for Manufacturing Defects,” Journal of Global SMT and Packaging, Vol. 2, No. 2, pp. 9-14, May 2002. #33

Tang, H. and Basaran, C.”Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints,” Int. Journal of Damage Mechanics, Vol. 10, No 3, pp. 235-255, July 2001. #29

Basaran, C. and Tang, H.,”Implementation of a Thermodynamic Framework for Damage Mechanics of Solder Interconnects in Microelectronic Packaging,” International Journal of Damage Mechanics, Vol. 11, No. 1, pp. 87-108, January 2002. #17

Basaran, C., Ye, H., Bush, P., Johnson, R., and Long, J.,” Inspection of Under Bump Metallization – Solder Ball Interfaces by SEM, EDX and Moire Interferometry,” TAP Technology, Vol. 4, pp. 23-27, 2002, Review article.#31

Ye, H., Lin, M., and Basaran, C.,”Failure Modes and FEM Analysis of Power Electronic Packaging,” Finite Elements in Analysis and Design, Vol. 38, Issue 7, pp. 601-612, May 2002. #25

Basaran, C. and Jiang, J.,”Measuring Intrinsic Elastic Modulus of Pb/Sn Solder Alloys,” Mechanics of Materials, 34, pp. 349-362, 2002, #26

Basaran, C., Cartwright, A., Zhao, Y. and Dishongh, T.”Reliability of Solder Bumps”, Advanced Packaging, Vol. 1, pp. 47-56, July 2002, Review Article. #52

Dishong, T., Basaran, C., Cartwright, A., Zhao, Y., and Liu, H., “Impact of Temperature Cycle Profile on Fatigue Life of Solder Joints,” IEEE Transactions on Advanced Packaging, Vol. 25, No 3, pp. 433 –438, August 2002. #35

Tang, H. and Basaran, C.”A Damage Mechanics Based Fatigue Life Prediction Model,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 120-125, March 2003. #21

Wen, Y. and Basaran, C.,”Thermal Stress Analysis of Multilayered Microelectronic Packaging,” Trans. Of ASME, Journal of Electronic Packaging, Vol. 125, No 1, pp. 134- 138, March 2003. #23

Ye, H., Basaran, C. and Hopkins, D., Thermomigration in Pb-Sn Solder Joints Under Joule Heating During Electric Current Stressing, Applied Physics Letters, Vol. 82, No 8, February 2003, #38.

Wen , Y.and Basaran, C. “Analysis of Multi-layered Microelectronic Packaging Under Uniformly Distributed Loading”, vol 40/13-14, pp 3331 - 3345, International. J. of Solids and Structures, May 2003, #45

Ye, H., Hopkins, D. and Basaran, C.”Measuring Joint Reliability: Applying the Moire Interferometry Technique,” Advanced Packaging, Vol. 1, pp.17-20, May 2003, Review article. #46

Ye, H., Basaran, C. and Hopkins, D., Damage Mechanics of Microelectronics Solder Joints Under High Current Densities,” International Journal of Solids and Structures, Vol. 40, No. 15, pp. 4021-4032, July 2003. #34

Basaran, C. and Wen, Y.,”Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation,” Trans. Of ASME J. of Electronic Packaging , Vol 125, No. 3, pp. 426-430, September 2003, #30

Liu, H., Cartwright, A. N. and Basaran, C.,” Sensitivity Improvement in Phase Shifted Moiré Interferograms Using 1-D Continuous Wavelet Transform Image Processing”, Optical Engineering 42(09), pp. 2646-2652, September 2003, #50

Ye, H., Hopkins, D. and Basaran, C.,”Measurement of High Electrical Current Density Effects in Solder Joints,” Advanced Microelectronics, Vol. 30, No. 5, pp. 13-16, September 2003, Review Article.#69

Ye, H., Basaran, C. Hopkins, D.,”Numerical Simulation of Stress Evolution During Electromigration in IC Interconnect Lines,” IEEE Trans. On Comp. Packaging Tech. Vol. 26, No. 3 pp.673-681, September 2003.#43

Basaran, C., Lin, M. and Ye. H. “A Thermodynamic Model for Electrical Current Induced Damage”, Int. Journal of Solids and Structures Vol. 40, No 26 pp. 7315-7327, November 2003 #37

Ye, H., Basaran, C. and Hopkins, D.,”Mechanical Degradation of Microelectronics Solder Joints Under Current Stressing,” Int. Journal of Solids and Structures, Vol 40 No 26, pp 7269-7284, November 2003 #40

Ye, H., Basaran, C. and Hopkins, D.,”Measurement of High Electrical Current Density Effects in Solder Joints,” Microelectronics Reliability, Vol. 43, issue 12, pp. 2021-2029, December 2003. #42

Wen, Y. and Basaran, C.,”An Analytical Model for Thermal Stress Analysis of Multi- layered Microelectronic Packaging,” Mechanics of Materials, 36, pp. 369-385, 2004. #47

Liu, H., Basaran, C., Cartwright, A. and Casey, W.,” Application of Moiré Interferometry to Determine Strain Fields and Debonding of Solder Joints in BGA Packages, IEEE Transactions on Components and Packaging Technologies, Vol. 27, No 1, pp. 217- 223,

March 2004. #28

Ye, H., Basaran, C. and Hopkins, D.,”Pb Phase coarsening in eutectic Pb/Sn flip chip solder joint under electrical current stressing,,” Int. J. of Solids and Structures, 41, pp. 2743-2755, 2004. #48

Liu, H., Cartwright, A., and Basaran, C. Moiré interferogram Phase Extraction: A Ridge Detection Algorithm Based on Continuous Wavelet Transform” Applied Optics, Vol. 43, No. 4/1, pp.850-857, February 2004, #51.

Liu, H., Cartwright, A. and Basaran, C.,”Experimental Verification of Improvement of Phase Shifting Moire Interferometry and Wavelet-Based Image Processing,” Optical Engineering, 43 (05) pp. 1206-1214, May 2004, #56

Basaran, C. Tang, H. and Nie, S.,”Experimental Damage Mechanics of Microelectronics Solder Joints Under Fatigue Loading,” Mechanics of Materials, 36, pp. 1111-1121, August 2004, #36

Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation I,” International Journal of Solids and Structures, vol. 41, pp. 4939-4958, September 2004. #59

Ye, H. Basaran, C. and Hopkins, D.”Deformation of Microelectronic Solder Joints Under Current Stressing and Numerical Simulation II,” International Journal of Solids and Structures, vol. 41, pp. 4959-4973, September 2004, #60

Basaran, C. and Nie, S.”An Irreversible Thermodynamic Theory for Damage Mechanics of Solids,” International Journal of Damage Mechanics, vol. 13, No 3, pp 205-224, July 2004, #41

Ye, H., Basaran, C., and Hopkins, D.,” Mechanical Implications of High Current Densities in Flip Chip Solder Joints,” International Journal of Damage Mechanics, Vol. 13, No. 4, pp 335-346, October 2004, #58

Gomez, J. and Basaran, C.”A Thermodynamics Based Damage Mechanics Constitutive Model for Low Cycle Fatigue Analysis of Microelectronics Solder Joints Incorporating Size Effect,” International Journal of Solids and Structures, Vol. 42, issue 13, pp. 3744- 3772, (2005) #67.

Nie, S., and Basaran, C. “A Micromechanical Model for Effective Elastic Properties of Particulate Composites with Imperfect Interfacial Bonds,” International Journal of Solids and Structures Vol. 42, pp 4179-4191, 2005, #62

Lin, M., and Basaran, C.”Electromigration Induced Stress Analysis Using Fully Coupled Mechanical-Diffusion Equations With Nonlinear Material Properties,” Computational Materials Science, Vol. 34/1 pp. 82-98, May 2005, #64

Basaran, C., Ye, H. Hopkins, D., Frear, D. and Lin, J.K.”Failure Modes of Flip Chip Solder Joints Under High Electrical Current Density,” Trans. Of ASME J. of Electronic Packaging, vol. 127, pp. 157-163, June 2005 #53

Basaran, C., Zhao, Y., Tang, H. and Gomez, J..”A Damage Mechanics Based Unified Constitutive Model for Solder Alloys,” Trans of ASME, Journal of Electronic Packaging, Vol. 127, issue 3, pp. 208-214, September 2005 . #18

Ye, H., Basaran, C. and Hopkins, D., ”Experimental Damage Mechanics of Micro/Power Electronics Solder Joints Under Electrical Current Stresses,” Int. J. of Damage Mechanics, vol. 15, pp. 41-68, January 2006, #65

Gomez, J. and Basaran, C. “ Nanoindentation of Pb/Sn Solder Alloys; Experimental and Finite Element Simulation Results”, Int. J. of Solids and Structures, vol. 43, (2006), pp. 1505-1527, 2006, #77

Gomez, J. and Basaran, C., ”Damage Mechanics Constitutive Model for Pb/Sn Solder Joints Incorporating Nonlinear Kinematic Hardening and Rate Dependent Effects Using a Return Mapping Integration Algorithm,” Mechanics of Materials, 38 (2006), 585-598.

#72

Gomez, J, Lin, M. and Basaran, C. “Damage Mechanics Modeling of Concurrent Thermal And Vibration Loading On Electronics Packaging” Multidiscipline Modeling in Materials and Structures, Vol.2, No.3, pp. 309-326, July 2006. #71.

Nie, S., Basaran, C., Hutchins, S. and Ergun, H,” Failure Mechanisms in PMMA/ATH Acrylic Casting Dispersion,” Journal of Mechanical Behavior of Materials, Vol. 17, No 2, 2006, pp. 79-95, #39

Basaran, C. and Nie, S.“A Thermodynamics Based Damage Mechanics Model for Particulate Composites,International Journal of Solids and Structures, 44, (2007) 1099- 1114. #63

Basaran, C. and Wen, Y., ”Analysis of Multilayered Microelectronic Packaging Under Thermal Gradient Loading,” IEEE Trans. On Components and Packaging Technologies, vol. 29, no 4, pp. 850-855, December 2006, #75.

Basaran, C. and Wen, Y. “Influence of Interfacial Compliances on Thermomechanical Stresses in Multilayered Microelectronic Packaging,” IEEE Trans. On Advanced Packaging, vol. 29, No. 4, pp. 666-673, November 2006,#61

Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration in Microelectronics Copper Interconnects,” International Journal of Materials and Structural Integrity, vol. 1, Nos1/2/3, 16-39, 2007, #76

Basaran, C. and Lin, M. “Electromigration Induced Strain Field Simulations for Nanoelectronics Lead-Free Solder Joints”, Int. J. of Solids and Structures, 44, (2007), 4909-4924. #68.

Gomez, J., and Basaran, C., ”Determination of Strain Gradient Plasticity Length Scale for Microelectronics Solder Alloys,” Trans. Of ASME Journal of Electronic Packaging, ASME Journal of Electronic Packaging, Vo. 129, No. 2, pp-120-128, June 2007. #66

Basaran, C. and Lin, M.,” Damage Mechanics of Electromigration Induced Failure,” Mechanics of Materials, 40 (2008) 66-79, #74

Basaran, C., Nie, S., Hutchins, S. and Ergun, H. ,”Influence of Interfacial Bond Strength on Fatigue Life and Mechanical Behavior of a Particulate Composite: An Experimental Study, Int. J. of Damage Mechanics, Vol. 17, No. 2, 123-148, March 2008 #54.

Chen, B. and Basaran, C. “Automatic Full Strain Field Moiré

Interferometry Measurement with Nano-scale Resolution” Experimental Mechanics, vol. 48, no 5, October 2008, pp. 665-673. #83

Abdulhamid, M., Li, S., Basaran, C. Thermomigration in lead-free solder joints, Int. J. of Materials and Structural Integrity, Vol. 2, Nos 1 / 2, pp. 11-34, 2008, #87

Basaran, C., Li, S., Abdulhamid, M.,” Thermomigration Induced Degradation in Solder Alloys,”, Journal of Applied Physics, 103, 123520 (2008), # 86

Basaran, C., Nie, S. and Hutchins, C., Time Dependent Behavior of a Particle Filled Composite PMMA/ATH at Elevated Temperatures” Journal of Composite Materials, Vol. 42, No. 19, pp. 2003-2025, 2008, #55

Li, S., Abdulhamid, M. and Basaran, C. “Simulating Damage Mechanics of Electromigration and Thermomigration,” Simulation: Transactions of the Society for Modeling and Simulation International Vol. 84, Number 8/9, pp. 391-401, August/September 2008, #91

Gomez, J. and Basaran, C. “Computational Implementation of Cosserat Continuum,”, International Journal of Materials and Production Technology, Vol. 34, No 1 / 2, pp 3-36, January 2009, #78

Abdulhamid, M. , Basaran, C,” Influence Of Thermomigration On Lead-Free Solder Joint Mechanical Properties”. Trans of the ASME Journal of Electronic Packaging,, March 2009, Vol. 131 / 011002-1-011002-12, #80

Li, S. and Basaran, C. “A Computational Damage Mechanics Model for Thermomigration,” Mechanics of Materials, vol. 41, issue 3, pp. 271-278, March 2009,

#82

Li, S., Abdulhamid, M., Basaran, C. and Lai, Y.S. “Damage Mechanics of Low Temperature Electromigration and Thermomigration” IEEE Trans. On Advanced Packaging, Vol. 32, No 2, pp., 478-485, May 2009, #85

Li, S., Sellers, Basaran, C., M. Schultz, A.,. and Kofke, D., ”Lattice Strain Due to an Atomic Vacancy,” Int. J. of Molecular Sciences, 2009, 10, 2798-2808, #81

Basaran, C. , Li, S. ,Hopkins D.C. and Veychard, D.”Electromigration Time To Failure of SnAgCuNi Solder Joints” Journal of Applied Physics, 106, 013707, (2009) # 92

Abdulhamid, M., Basaran, C., and Lai, Y.S., ”Thermomigration vs. Electromigration in Microelectronics Solder Joints” IEEE Transactions on Advanced Packaging, Vol. 32, No 3, pp. 627-635, August 2009, #79

Ragab, T. and Basaran, C. “A Framework for Stress Computation in Single-Walled Carbon Nanotubes Under Uniaxial Tension” Computational Material Science, 46, 1135- 1143, (2009) #89

Ragab, T. and Basaran, C.,” Joule heating in single-walled carbon nanotubes,” Journal of Applied Physics, 106, 063705, (2009), #95

Basaran, C., Abdulhamid, M.” Low Temperature Electromigration and Thermomigration in Lead-Free Solder Joints,” Mechanics of Materials, 41, (2009) 1223-1241, #88

Ragab, T., Basaran, C. “A Quantum Mechanical Formulation of Electron Transport Induced Wind Forces in Metallic Single Walled Carbon Nanotubes:” Carbon 48 ( 2010) 47-53, #96

Li, S. and Basaran, C. ”Effective Diffusivity of Lead-Free Solder Alloys” Computational Materials Science 47, (2009) 71-78, #90

Gunel, E.M., Basaran, C. Micro-deformation mechanisms in thermoformed alumina trihydrate reinforced poly (methyl methacrylate) Materials Science and Engineering: A, 523 (2009) 160-172, #99

Seller, M. Schultz, A. Basaran, C. and Kofke, D, "Atomistic Modeling of beta-Sn Surface Energies and Adatom Diffusivity" , Applied Surface Science, 256, (2010) 4402-4407.

#93

Ragab, T. and Basaran, C. “Semi-classical transport for predicting joule heating in carbon nanotubes" Physics Letters A, Vol.374 Issue 24 (2010) pp. 2475-2479, #102

Seller, M., Schultz, A., Basaran, C. and Kofke, D., “bSn Grain Boundary Structure and Self-Diffusivity via Molecular Dynamics Simulation” Physical Review B, 81, 134111 (2010) #103

Gunel, E.M., and Basaran, C. “Stress Whitening Quantification in Thermoformed of Mineral Filled Acrylics”, ASME Journal of Engineering Materials and Technology, July 2010, Vol. 132, 031002-11, #100

Ragab, T and Basaran, C. “The prediction of the effective charge number in single walled carbon nanotubes using Monte Carlo simulation " Carbon, 49, (2011) 425-434, #104

Chen, B. and Basaran, C. “Statistical Phase Shifting Step Estimation Algorithm Based on the Continuous Wavelet Transform for High Resolution Interferometry Metrology” Applied Optics, Vol. 50, No 4, 586-593, February 2011 # 98

Sellers, M., Schultz, A. J., Kofke, D., and Basaran , C ” Solute Effects on bSn Grain Boundary Energy and Shear Stress,” ASCE J. of Nanomechanics and Micromechanics

,Vol. 1, Number 1, pp. 41-50, March 2011, #109

Chen, B. and Basaran, C. Measuring Joule Heating and Strain Induced by Electrical Current with Moiré Interferometry” Journal of Applied Physics, 109, 074908 (2011) # 97

Ragab, T. and Basaran, C. “The Unraveling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulation,” ASME Journal of Electronic Packaging, June 2011, Vol. 133, 020903-1- 7, #107

Lee, Y. and Basaran, C. “A Creep Model for Solder Alloys” Trans. Of ASME, J. of Electronic Packaging, vol. 133, issue 4, 044501-1, December 2011,#101

Sellers, M., Schultz, A. J., Basaran , C. and Kofke, D.,” Effect of Cu and Ag Solute Segregation on bSn Grain Boundary Diffusivity,” Journal of Applied Physics, 110, 013528-1 (2011) #110

Chen, B. and Basaran, C., ”Near Field Modeling of the Moiré Interferometry for Nanoscale Strain Measurement,” Journal of Optics and Lasers in Engineering, 50 (2012) 976-984, #111.

Yao, W. and Basaran, C., ” Electromigration Analysis of Solder Joints under AC Load: a Mean Time to Failure Model” J. of Applied Physics, 19 March 2012, Journal of Applied Physics , Vol.111, Issue 6, #115

Chen, B. and Basaran, C., ”Far-Field Modeling of Moiré Interferometry using Scalar Diffraction Theory,” 50 (2012) 1168-1176, Journal of Optics and Lasers in Engineering,

#112

Yao, W., Basaran. C., “Reduced Impedance and Super Conductivity of Lead-free Solder Alloys at Very High Frequencies,” Volume 8, No 5 (2012) 503-505, DOI: 10.1007/s13391-012-2054-6 Electronic Materials Letters, #118

Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal Stretching of Acrylics: Part I Theory” Mechanics of Materials, Volume 43, Issue 12, December 2011, Pages 979–991 #105

Gunel, E.M. and Basaran, C. “Damage Characterization in Non-Isothermal Stretching of Acrylics: Part II Experimental Validation, Mechanics of Materials , Volume 43, Issue 12, December 2011, Pages 992–1012 #106

Basaran, C and Gunel, E.M., “Predicting Elastic Modulus of Particle Filled Composites,” Int. J of Materials and Structural Integrity , pp. 100-108, Vol. 7, Nos1/2/3, 2013 #120

Lee, Y. and Basaran, C., “Molecular Dynamics of Visco-Plasticity in b-Tin Lattice and Grain Boundary.” Computational Material Science, 68, (2013) 290-296 .#116

Gautreau, P., Ragab, T., Basaran, C.,” Hot Phonons Contribution to Joule Heating in Single-Walled Carbon Nanotubes”, Journal of Applied Physics, 112, 103527 (2012) doi:10.1063/1.4766901 #119

Gunel, E. and Basaran, C., ”Influence of Filler Content and Interphase properties on Large Deformation Micromechanics of Particle Filled Acrylics,” 57, (2013) 134-146 , Mechanics of Materials #108

Lee, Y. and Basaran, C., ”Atomic Level Shear Stress-Strain Behavior of b-Sn” ASCE J. of Nanomechanics and Micromechanics, vol. 3, No 4, December 2013, #123

Yao, W., and Basaran, C., ” Electromigration in Lead-Free Solder Joints under High Frequency Pulsed Current: an Experimental Study, Int. J. of Damage Mechanics, Volume 22 Issue 8 November 2013 pp. 1127 - 1143 #122 

Gautreau, P. ,Ragab, T., Basaran, C,” Influence of Hot Phonons on Wind Forces in Metallic Single Walled Carbon Nanotubes,” Carbon, 57, (2013), 59-64 #126

Yao, W. and Basaran, C., ”Electromigration Damage Mechanics of Lead-Free Solder Joints Under Pulsed DC Loading: A Computational Model” Computational Material Science, 71, (2013) 76-88 #113

Yao, W. and Basaran, C. ”Electrical Pulse Induced Impedance and Material Degradation in IC Chip Packaging,” Electronic Materials Letters, Vol. 9, No. 5, (2013), pp. 565-568

#125

Yao, W. and Basaran, C.” Damage Mechanics of Electromigration and Thermomigration in Lead-free Solder Alloys under AC: An Experimental Study, “Int. J. of Damage Mechanics, Vol. 23 Issue 2 March 2014, pp. 203-221. #121

Dongkeon Kim, Gary Dargush, Cemal Basaran, “A cyclic two-surface thermoplastic damage model with application to metallic plate dampers”, Engineering Structures Volume 52, July 2013, Pages 608–620. #132

Lee, Y. and Basaran, C.,”A Multi-scale Modeling Approach for Bridging Molecular Dynamics with Finite Element Analysis,” Journal of Computational Physics, 253 (November 2013) 64-85. #114

Yao, W. and Basaran, C. “Computational Damage Mechanics of Electromigration and Thermomigration” J. of Applied Physics, 114, 103708, (2013), #129

Chu, Y., Ragab, T. and Basaran, C., ”Size Effect in Graphene Nano Ribbon,” Computational Materials Science, 81 (2014) 269-274 #117

yee, Y. and Basaran, C. “Effect of Ni Solute on Grain Boundary Diffusivity and Structure of βSn”,” Computational Materials Science 92 (2014) 1-7 #128

Gautreau, P., Ragab, T. Chu, Y. and Basaran, C. “Phonon Dispersion and Quantization Tuning of Strained Carbon Nanotubes for Flexible Electronics” J. Of Applied Physics, 115, 243702 (2014) #133

Chu, Y., Ragab, T., Gautreau, P., Basaran, C., Mechanical Properties of Hydrogen-Edge- Passivated Chiral Graphene Nanoribbons , ASCE Journal of Nanomechanics and

Micromechanics, 04015001-1, March 2015 . DOI: 10.1061/(ASCE)NM.2153- 5477.0000101 #131

Chu, Y., Gautreau, P., Ragab, T. and Basaran, C.,”An accelerated algorithm for full band electron phonon scattering rate computation,” Computer Physics Communications, 185, (2014) 3392-3397 #135

Chu, Y., Gautreau, P., Basaran, C.” Parity Conservation in Electron-Phonon Scattering of Zigzag Graphene Nanoribbon” Applied Physics Letter, issue 11, volume 105, 113112, Sep-2014. #136

Gautreau, P., Chu, Y. Ragab, T., Basaran, C,” , Phonon-Phonon Scattering Rates in Carbon Nanotubes, Computational Materials Science, 103, (2015) 151-156 # 130

Chu, Y., Gautreau, P., Ragab, T. and Basaran, C., “Temperature Dependence of Joule Heating in Zigzag Graphene Nanoribbon,” Carbon, 89, (2015) 169-175 #137

Therence Temfack, Cemal Basaran, “Experimental Verification of a Thermodynamic Fatigue Life Prediction Model” Materials Science and Technology, Volume 31, Issue 13, 2015, # 138

Chu, Y., Gautreau, P., Ragab, T.. and Basaran, C. “Strained Phonon-Phonon Scattering Rates in Carbon Nanotubes”, Computational Materials Science 112 (2016) 87–91, #134

Ji Zhang, J., Ragab, T., Basaran, C. “Influence of Vacancy Defects on the Damage Mechanics of Graphene Nano Ribbons”, Int. J. of Damage Mechanics, Volume: 26 issue: 1, page(s): 29-49, 2017, doi: 10.1177/1056789516645645 #140

Fu, Y., Ragab, T. , Basaran, C., The Effect of Stone-Wales Defects on the Mechanical Behavior of Graphene Nano-Ribbons". Computational Materials Science 124 (2016), 142-150, #142

Zhang, J., Ragab, T., Basaran, C., “ The effects of vacancy defect on the fracture behaviors of zigzag graphene nanoribbons,”, Int. J. of Damage Mechanics, vol. 26, 4: pp. 608-630, September 2016, DOI: 10.1177/1056789516671795, #143

Basaran, C. “ Unification of Newtonian Mechanics and Thermodynamics: A Review Article ” MOJ Civil Engineering, 2016, 1 (3) DOI:10.15406/mojcr.2016.01.00019 , #146

Ragab, T. , McDonald, J., Basaran, C.,” Aspect ratio effect on shear modulus and ultimate shear strength of graphene nanoribbons” Diamond & Related Materials 74 (2017) 9-15, DOI information: 10.1016/j.diamond.2017.01.017, #145

Zhang, W., Ragab, T., Basaran, C “Unraveling Mechanics of Armchair and Zigzag Graphene Nanoribbon, Int. J of Damage Mechanics, vol. 26 (3), pp. 447-462, January, 2017. # 141

Zhang, W., Basaran, C, Ragab, T., “Impact of Geometry on Transport Properties of Armchair Graphene Nanoribbon Heterojunction” Carbon, 124 (2017) 422-428. #148

Zhang, J., Ragab, T., Basaran, C , “Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons, ” Int. J. of Damage Mechanics, (accepted 12/11/2017). #147